Accurate Propagation Delay Time Control Technique for High-Density PWB Using Insulated Copper Wire.
نویسندگان
چکیده
منابع مشابه
Overview of wire bonding using copper wire or insulated wire
Wire bonding using copper or insulated wire leads to many advantages and new challenges. Research is intensively performed worldwide, leading to many new findings and solutions. This article reviews recent advances in wire bonding using copper wire or insulated wire for advanced microelectronics packaging. Journal articles, conference articles and patents published or issued recently are review...
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Purpose – This paper attempts to review recent advances in wire bonding using copper wire. Design/methodology/approach – Dozens of journal and conference articles published recently are reviewed. Findings – The problems/challenges such as wire open and short tail defects, poor bondability for stitch/wedge bonds, oxidation of Cu wire, strainhardening effects, and stiff wire on weak support struc...
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2001
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.4.523